Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/HCI solution

ABSTRACT

Copper can be etched with selectivity to Ta/TaN barrier liner and SiC hardmask layers, for example, to reduce the potential copper contamination. The copper film can be recessed more than the liner to further enhance the protection. Wet etch solutions including a mixture of HF and HCl can be used for selective etching copper with respect to the liner material, for example, the copper film can be recessed between 2 and 3 nm, and the barrier liner film can be recessed between 1.5 and 2 nm.

FIELD OF THE INVENTION

The present invention relates generally to methods for fabricating anintegrated-circuit device, and particularly to selective wet etchesprocesses between copper, tantalum and tantalum nitride.

BACKGROUND OF THE INVENTION

Current technologies for fabricating ultra-large scaleintegrated-circuit devices employ copper interconnects. Interconnectionsusing copper have replaced aluminum in the fabrication of ultra-largescale integrated-circuit devices due to its lower specific resistanceand improved electromigration (EM) characteristics.

Usually, the copper interconnects are surrounded by barrier liners, suchas tantalum (Ta) and/or tantalum nitride (TaN), to prevent outdiffusionand corrosion of the copper interconnect lines. For example, copper candiffuse into the surrounding dielectric materials at low temperatures,leading to device performance degradation. Copper can also be oxidizedand corroded during the standard processing of device fabrication, suchas oxygen or hydrofluoric acid (HF) exposure.

A damascene process can be used to form copper interconnect structures.Basically, a damascene process includes etching an interlevel dielectriclayer (ILD) to form lines and via patterns, lining the patterns withbarrier materials, and then filling with copper, followed by aplanarization process, e.g., chemical mechanical planarization, toremove excess copper and barrier materials.

In semiconductor devices using copper interconnects, time dependentdielectric breakdown (TDDB) characteristics can be important aspects ascompared to other interconnect metals such as aluminum or tungsten, dueto the high diffusion of copper. For example, after the planarization,copper can migrate over time to cause bridges between adjoining copperwirings, leading to the deterioration of leakage currentcharacteristics.

As an example, in the basic damascene process for copper interconnectstructures, there can be a ‘triple point’ where Cu/liner/ILD cometogether after the planarization step, which can be a weak spot formaterial diffusion. For example, at the “triple point”, copper caneasily diffuse into the dielectric layer, since the dielectric layer caninclude a damaged portion due to the deposition of a cap layer. Further,there can be local diffusion of corroding substances into theinterconnect line during processing. The weak spots thus can decreaseoperational reliability due to current leakage and thus increase therisk of operational breakdown, such as time dependent dielectricbreakdown (TDDB).

In addition, high electric field can be observed at the top edges of theinterconnect lines, which can cause operational breakdown orelectromigration failures due to the high electrical fieldconcentration.

It is therefore desirable to provide processes and structures of copperinterconnect to improve device reliability.

SUMMARY

In some embodiments, methods for selective etching copper with respectto the liner are provided, for example, to reduce the potential coppercontamination. The copper film can be recessed more than the liner tofurther enhance the protection. In some embodiments, the copper film canbe recessed between 2 and 3 nm. The liner film can be recessed between1.5 and 2 nm. In some embodiments, the liner film can include Ta or TaN.

In some embodiments, wet etch methods and solutions for selectiveetching copper with respect to the liner material are provided. The wetetch solutions can include a mixture of HF and HCl.

In some embodiments, the concentration of HF in the HF/HCl mixture canbe between 0.5 and 0.8 vol %, such as between 0.55 and 0.7 vol %. Theconcentration of HCl in the HF/HCl mixture can be between 7 and 10 vol%, such as between 6 and 9 vol %. For example, using HF having 2.5 vol %concentration, and HCl having 30-36 vol % concentration, a HF/HClmixture can include a mixture ratio of 1:1:2 for HF:HCl:H₂O.

In some embodiments, the concentration of HF in the HF/HCl mixture canbe between 0.3 and 0.5 vol %, such as between 0.35 and 0.45 vol %. Theconcentration of HCl in the HF/HCl mixture can be between 3 and 8 vol %,such as between 4 and 7 vol %. For example, using HF having 2.5 vol %concentration, and HCl having 30-36 vol % concentration, a HF/HClmixture can include a mixture ratio of 1:1:4 for HF:HCl:H₂O.

In some embodiments, the wet etch processes can include a process timebetween 30 and 60 seconds. The process temperature can be between 25 and40 C. In some embodiments, a water rinse can be performed, for example,using deionized water at a temperature between 15 and 35 C, such as roomtemperature, and for a time between 60 and 120 seconds. The rinsingprocess can remove the etch solution to prevent further etching.

In some embodiments, a SiC layer can be formed as a hard mask layer onthe dielectric layer, which can protect the dielectric layer during therecess of the copper and the liner materials. The copper and the linermaterials can be selectively etched with respect to the SiC hard mask,thus providing a recess copper and liner materials, reducing potentialcopper diffusion damage.

BRIEF DESCRIPTION OF THE DRAWINGS

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. The drawings are not to scale and the relative dimensionsof various elements in the drawings are depicted schematically and notnecessarily to scale.

The techniques of the present invention can readily be understood byconsidering the following detailed description in conjunction with theaccompanying drawings, in which:

FIGS. 1A-1B illustrate a prior art copper interconnect structureaccording to some embodiments.

FIGS. 2A-2B illustrate a copper interconnect structure according to someembodiments.

FIGS. 3A-3B illustrate other copper interconnect structures according tosome embodiments.

FIGS. 4A-4I illustrate a fabrication process for a copper interconnectstructure according to some embodiments.

FIGS. 5A-5B illustrate etch rates of some tested chemistries accordingto some embodiments.

FIG. 6 illustrates thickness losses of different hardmask materialsaccording to some embodiments.

FIGS. 7A-7B illustrate flow charts for forming a recess structure ofcopper, Ta, and TaN according to some embodiments.

FIGS. 8A-8B illustrate other flow charts for forming a recess structureof copper, Ta, and TaN according to some embodiments.

DETAILED DESCRIPTION

A detailed description of one or more embodiments is provided belowalong with accompanying figures. The detailed description is provided inconnection with such embodiments, but is not limited to any particularexample. The scope is limited only by the claims and numerousalternatives, modifications, and equivalents are encompassed. Numerousspecific details are set forth in the following description in order toprovide a thorough understanding. These details are provided for thepurpose of example and the described techniques may be practicedaccording to the claims without some or all of these specific details.For the purpose of clarity, technical material that is known in thetechnical fields related to the embodiments has not been described indetail to avoid unnecessarily obscuring the description.

In some embodiments, methods are provided to form copper interconnectstructures having improved reliability. For example, copper and barrierliner can be recessed with respect to the surrounding dielectricmaterial, thus reducing or eliminating the potential diffusion ofcopper. Further, copper can be recess more than the barrier liner,providing a copper interconnect structure with higher blockage of copperdiffusion.

Copper metallization requires a conductive liner to interface with thesurrounding dielectric material to prevent copper diffusion to activedevices. After the copper layer is planarized, for example, by chemicalmechanical polishing, the point where the copper, liner and dielectricmeet can present a weak spot for copper injection damage to thedielectric layer.

Damascene or dual damascene process can be use to fabricate copperinterconnect structures. Such processes for copper interconnectstructures can present a potential reliability problem, for example, byforming a weak spot for copper diffusion.

FIGS. 1A-1B illustrate a prior art copper interconnect structureaccording to some embodiments. An interconnect structure 100 can includecopper interconnect lines 120 and 125, connected through a copper via140. The copper interconnect lines and via are disposed in interleveldielectric layer 110 and 115. The copper interconnect lines and via areseparated from the surrounding dielectric 110 and 115 by barrier liners130 and 135 and cap layer 150.

At the interface between the copper interconnect line 120, the barrierliners 130 and the dielectric layer 110, there can be a weak spot 160,sometimes referred to as a “triple point”. The “triple point” can causeoperating failures, for example, copper ions from the copperinterconnect line can diffuse 170 through the barrier liner 130 to thedielectric layer 110, which can increase a time dependent dielectricbreakdown (TDDB) of the dielectric layer 130.

In some embodiments, reliability improvements on the copper structuresare provided by modifying the “triple point”. The copper layer can berecessed to move away from the “triple point”. The recess of copperlayer can address the reliability, e.g., TDDB scaling problems, throughthe inhibition of diffusion of copper into the dielectric. Also, copperrecess can allow a self-align scheme of the via in both x and ydirections to compensate for a lack of overlay scaling.

In addition to recessing the copper interconnect line, the liner andbarrier materials can also be recessed to further improve thereliability, since with the recessed liner/barrier, copper ions can wetand diffuse up the liner/barrier due to the enhanced electric field.

In some embodiments, structures and methods for selective etching copperwith respect to the liner are provided, for example, to improve thereliability of the copper devices by reducing potential coppercontamination. The copper film can be recessed more than the liner tofurther enhance the protection. In some embodiments, the copper film canbe recessed between 2 and 3 nm. The liner film can be recessed between1.5 and 2 nm. In some embodiments, the liner film can include Ru, TiN,Ta or TaN.

FIGS. 2A-2B illustrate a copper interconnect structure according to someembodiments. An interconnect structure 200 can include copperinterconnect lines 220 and 225, connected through a copper via 240. Thecopper interconnect lines and via are disposed in interlevel dielectriclayer 210 and 215. The dielectric layer can include silicon oxide or alow dielectric constant material. The copper interconnect lines and viaare separated from the surrounding dielectric 210 and 215 by barrierliners 230 and 235 and cap layer 250. The barrier liners can include aconductive diffusion barrier material, such as tantalum, tantalumnitride, or a multilayer of tantalum and tantalum nitride. The barrierliner can include a layer or a multilayer, for example, a layer ofbarrier material and a layer of liner material. The cap layer caninclude a dielectric material, which can be a diffusion barrier and/or ahardmask material for the planarization process. Suitable materials forthe cap layer can include SiC, SiN, and SiCN. The contact resistancebetween the bottom copper layer 220 and the top copper layer 225 can below, since there is copper to copper contact between the top and bottomcopper layers 220 and 225.

The copper layer 220 and the barrier liner 230 can be recessed withrespect to the dielectric layer 210. Further, the copper layer 220 canbe recessed with respect the barrier liner 230. The recess structure canreduce interline current leakage, together with a reliabilityenhancement by increasing the dielectric lifetime. The electric-fieldconcentrations at the top edges of the interconnect lines duringoperation can be reduced, further reducing potential operationalbreakdown or electromigration failures.

FIGS. 3A-3B illustrate other copper interconnect structures according tosome embodiments. In FIG. 3A, an interconnect structure 300 can includecopper interconnect lines 320 and 325, connected through a copper via340. The copper interconnect lines and via are disposed in interleveldielectric layer 310 and 315. The copper interconnect lines and via areseparated from the surrounding dielectric 310 and 315 by barrier liners330 and 335. The barrier layer 335 can surround the copper layer 325,even at the bottom of the via 340. A hardmask layer 370 can be formed onthe dielectric layer 310, for example, for copper planarizationstopping. A cap layer 350 can be formed on the copper layer 320 forprevent copper diffusion to the dielectric 315. There can be highcontact resistance between the bottom copper layer 320 and the topcopper layer 325, in exchange for simplicity of the structurefabrication process.

The copper layer 320 and the barrier liner 330 can be recessed withrespect to the cap layer 370. Further, the copper layer 320 can berecessed with respect the barrier liner 330.

In FIG. 3B, an interconnect structure 305 can include copperinterconnect lines 322 and 325, connected through a copper via 345. Thecopper interconnect lines and via are disposed in interlevel dielectriclayer 312 and 317. The copper interconnect lines and via are separatedfrom the surrounding dielectric 312 and 317 by barrier liners 332 and337. The barrier layer 337 can surround the copper layer 327, even atthe bottom of the via 345. A hardmask layer 375 can be formed on thedielectric layer 312, for example, for copper planarization stopping. Acap layer 355 can be formed on the copper layer 322 for prevent copperdiffusion to the dielectric 317. The cap layer 355 can be etched duringthe formation of the via 345, thus exposing a portion of the surface ofthe copper layer 322. The contact resistance between the bottom copperlayer 320 and the top copper layer 325 can be lower, due to the absenceof the cap layer 355 at the via 345.

The copper layer 320 and the barrier liner 330 can be recessed withrespect to the cap layer 370. Further, the copper layer 320 can berecessed with respect the barrier liner 330.

FIGS. 4A-4I illustrate a fabrication process for a copper interconnectstructure according to some embodiments. In FIG. 4A, a dielectric layer410 is provided. The dielectric layer 410 can be formed on a substrate,such as a silicon wafer. Transistor structures can be formed on thesubstrate. The dielectric layer 410 can include silicon oxide or a lowdielectric constant material, e.g., a dielectric material havingdielectric constant less than that of silicon oxide, such as fluorine orcarbon doped silicon oxide, porous silicon oxide, or organic polymericdielectrics.

In FIG. 4B, a hardmask layer 470 is formed on the dielectric layer 410.The hardmask layer can be used for planarization stop, as shown in alater figure. The hardmask material can include SiC or SiCN. Thethickness of the hardmask layer 470 can be between 10 nm to 2000 nm.

In FIG. 4C, an interconnect pattern is formed in the dielectric layer410. The interconnect pattern can include a line pattern. Aphotolithography process and an etch process can be used to form theinterconnect pattern 412. For example, a photoresist mask can bedeposited, e.g., spin on the hardmask layer 470. An exposure can beperformed through a mask to cross link the photoresist material that isoutside of the interconnect pattern. The photoresist then can bedeveloped to remove the portion that is not crossed link. An etchprocess, such as a reactive ion etching process, can be used to etch thedielectric layer 410, using the photoresist as a pattern. After completeetching, the photoresist can be removed, forming the interconnectpattern 412 in the dielectric layer 410. Different etch process can beused, such as a first etch process to remove the hardmask material, anda second etch process to remove the dielectric material.

In FIG. 4D, a barrier layer 430 and a copper layer 420 are deposited onthe interconnect pattern. For example, the barrier layer 430 can includea multilayer of Ta/TaN or Ru/TaN. TaN can be an excellent diffusionbarrier for copper, and Ta or Ru can serve as an adhesion promoter forbonding copper layer to the TaN layer. Other structures can also beused, such as a TaN/Ta multilayer barrier, or TiN to replace TaN as thediffusion barrier for copper. The barrier layer 470 can be deposited byany deposition process, such as atomic layer deposition, chemical vapordeposition, or physical vapor deposition.

The copper layer 420 can be formed by chemical vapor deposition,physical vapor deposition, or electroplating process. In someembodiments, a copper seed layer can be deposited on the barrier layerby physical vapor deposition. The copper seed can serve as an adhesionpromoter, or a seed layer for a subsequent copper fill process using anelectroplating process.

In FIG. 4E, a planarization process, such as a chemical mechanicalpolish process, is performed, using the hardmask layer 470 as aplanarization stop. The planarization process removes the barrier layerand the copper layer outside of the interconnect pattern, leaving aninterconnect copper layer 420 on a barrier layer 530 within theinterconnect pattern.

In FIG. 4F, a recess process is performed, recessing the copper layer420 with respect to the barrier layer 430 with respect to the hardmasklayer 470. The copper 420 can be recessed an amount 422 between 1 and 8nm, such as between 2 and 3 nm. The barrier 430 can be recessed anamount 432 between 0.5 and 6 nm, such as between 1.5 and 2.5 nm. Otherrecess amounts can be used, depending on the optimization of theinterconnect structure.

In some embodiments, the hardmask layer can be removed or omitted. Forexample, the planarization process can stop on the dielectric layer 410instead of on the hardmask layer 470. The recess of the copper can bewith respect to the dielectric layer 410 instead of with respect to thehardmask layer 470.

In FIG. 4G, a cap layer 450 is formed on the exposed copper layer 420.The cap layer 450 can include a diffusion barrier material such as TaN.In FIG. 4H, a dielectric layer 415 is formed on the cap layer 450. Thedielectric layer 415 can have the same material as the dielectric layer410, or can have different dielectric material.

In FIG. 4I, copper via 440, copper interconnect line 425, and barrier435 can be formed in the dielectric layer 415. For example, similar tothe photolithography and etch processes can be used to form the via andinterconnect patterns, then barrier and copper materials can bedeposited to fill the patterns. A planarization process can be performedto remove excess barrier and copper materials. The etch process can etchthrough the cap layer 450, exposing the copper layer 420 beforedepositing the barrier 435 and copper layer 425. In addition, anotheretch process can be performed after depositing the barrier layer 435 toexpose the copper layer 420 before depositing the copper layer 425. Thisprocess can provide low contact resistance for the copper to copperinterconnect, since the copper layer 425 can be connected to the copperlayer 420 without any cap layer or barrier layer in between.Alternatively, the cap layer 450 and/or the barrier layer 435 can stay,simplifying the fabrication process, but can provide higher contactresistance. The copper recess structure can provide reliabilityimprovements in damascene interconnect structures, due to theelimination of the interface between the copper, barrier, and dielectriclayers.

The above process describes a general damascene process to form thecopper via 435 and copper line 425. Single damascene or dual damasceneprocesses can be used, for example, the copper via structure can beformed before forming the copper line structure in a multilayerdielectric layer 415, or the copper via and the copper line structurescan be formed together in a single dielectric layer 415. Further, therecan be variations in the fabrication process of the copper interconnectstructure. For example, one component can perform multiple functions, ora function performed by one component can be distributed over multiplecomponents.

In some embodiments, compositions and wet etch processes are provided toform the recess of the copper and barrier, e.g., Ta/TaN, Ta/Ti, orTa/Ru, with respect to the dielectric layer or the hardmask layer.Different chemical compositions and etch processes are screened toobtain desired etch rates for copper, Ta and TaN to achieve the recessstructure.

The screening chemistries can include strong acids such as nitric acid(HNO₃), sulfuric acid (H₂SO₄), and hydrochloric acid (HCl). Thescreening chemistries can include strong bases such as ammoniumhydroxide (NH₄OH, 30 vol %), and tetramethyl ammonium hydroxide(N(CH₃)₄OH, TMAH, 25 vol %). The screening chemistries can includefluorides such as hydrofluoric acid (HF), and ammonium bifluoride(NH₄HF₂, ABF). The screening chemistries can include metal chelatorssuch as ethylenediaminetetraacetic acid (EDTA), oxalic acid, andascorbic acid. The screening chemistries can include halogen salts suchas quarternary ammonium salt (TMAH or TMAOH). Other screeningchemistries can also be used, such as strong oxidizers, includinghydrogen peroxide (H₂O₂). Different dilutions of the chemistries canalso be screened.

Different substrates can be used, such as silicon oxide substrate,including thermal oxide, chemical vapor deposition oxide, plasmaenhanced chemical vapor deposition oxide, low pressure chemical vapordeposition oxide, oxidation with tetraethylorthosilicate (TEOS). Lowdielectric constant substrates can also be used, such as fluorinatedoxide, carbonated oxide, and organic polymers, including hydrogensilsesquioxane (HSQ), methyl silsesquioxane (MSQ), and polyimides.Different hardmask materials can be used, such as SiC, SiCN and SiN.

Other etch conditions can be screened, such as etch times (between 15and 60 seconds), and etch temperatures (between room temperature and 60C).

The etch rates, e.g., thicknesses before and after exposing thesubstrate to the etch chemistries, can be characterized by ellipsometry,four-point probe for sheet resistance measurement, and X-rayfluorescence spectrometry (XRF).

In the screening process, etch chemistries, dilutions, etch conditionsand substrate materials are selected to achieve an etch selectivity ofabout 2:1 for copper with respect to Ta and TaN. For example, total Taand TaN thickness loss can be about 4 nm while total copper thicknessloss can be about 8 nm. After achieving the etch selectivity for Cu withrespect to Ta and TaN, substrate materials can be evaluated to achievezero or minimum thickness loss.

FIGS. 5A-5B illustrate etch rates of some tested chemistries accordingto some embodiments. In FIG. 5A, etch rates for copper, tantalum andtantalum nitride are shown for selective etch chemistries, includingvarious combination of HF, acetic acid, hydrogen peroxide, H₂SO₄, HNO₃,HCl, NH₄OH and TMAH. The starting chemistries can have differentconcentrations, for example, HF can be obtained at 48 to 52 vol %concentration, and then can be further diluted with water at a ratio of1:20 (HF:H₂O) to achieve about 2.5 vol % HF concentration. Acetic acidcan be obtained and used at 99 vol % concentration. Hydrogen peroxidecan be obtained and used at 30 vol % concentration. H₂SO₄ can beobtained and used at 98 vol % concentration. HNO₃ can be obtained andused at 69 vol % concentration. HCl can be obtained and used at 30-36vol % concentration. NH₄OH can be obtained and used at 38 vol %concentration. TMAH can be obtained at 25 vol % concentration, and thencan be further diluted with water at a ratio of 1:2 (TMAH:H₂O) toachieve about 12.5 vol % TMAH concentration.

The results from seven etch chemistries are shown in FIG. 5A, togetherwith control etch rates using water. The chemistries include HF:CH₃COOHat 1:1 ratio, e.g., 2.5 vol % HF mixed with 99 vol % acetic acid. Thechemistries include HF:H₂O₂ at 1:1 ratio, e.g., 2.5 vol % HF mixed with30 vol % hydrogen peroxide. The chemistries include HF:H₂SO₄ at 1:1ratio, e.g., 2.5 vol % HF mixed with 98 vol % sulfuric acid. Thechemistries include HF:HCl at 1:1 ratio, e.g., 2.5 vol % HF mixed with36 vol % hydrochloric acid. The chemistries include HF:HNO₃ at 1:1ratio, e.g., 2.5 vol % HF mixed with 69 vol % nitric acid. Thechemistries include HF:NH₄OH at 1:1 ratio, e.g., 2.5 vol % HF mixed with38 vol % ammonium hydroxide. The chemistries include HF:TMAH at 1:0.5ratio, e.g., 2.5 vol % HF mixed with 12.5 vol % tetramethylammoniumhydroxide. Other chemistries are also tested but not shown, such asH₂SO₄:H₂O₂ (SPM, sulfuric acid-hydrogen peroxide mixture) and NH₄OH:H₂O₂(APM, ammonium hydroxide-hydrogen peroxide mixture). A corrosioninhibitor such as benzotriazole (BTA), and mercapto compounds can beadded to prevent copper oxidization.

The etch conditions include an etch time of 30 seconds, followed by adeionized water rinse for 120 seconds at room temperature. Thetemperature of the etch process is at 40 C.

All combinations showed various etching degrees of copper, Ta, and TaN,even water (0-1 nm). Different behavior for Ta and TaN can be observedfor different chemistries. For example, Ta and TaN are barely etched forHF:CH₃COOH, HF:H₂O₂, HF:NH₄OH, and HF:TMAH. Thus these chemistrycombinations are not quite suitable for recessing copper, Ta and TaN.The mixture 510 of HF:HNO₃ are too aggressive, resulting to high etchrates for copper, Ta, TaN, and therefore is not suitable. Among thesechemistries, the mixtures of HF:H₂SO₄ and HF:HCl 520 can providereasonable etch rates for copper and TaN, but with high etch rate forTa, e.g., etch selectivity for Cu/Ta/TaN is 1:4:1. Thus the mixtures ofHF:H₂SO₄ and HF:HCl can be further optimized for performing copperrecess structure, e.g., to achieve the 40 A Ta/TaN etch and controlledCu etching.

Other chemistries are also evaluated, for example, SPM and APM with andwithout HF additive. The tested chemistries include H₂SO₄:H₂O₂,H₂SO₄:H₂O₂:HF, NH₄OH:H₂O₂, and NH₄OH:H₂O₂:HF. The chemistries includeH₂SO₄:H₂O₂:H₂O at 5:1:10 ratio, e.g., 98 vol % sulfuric acid mixed with30 vol % hydrogen peroxide and water at 5:1:10 ratio. The chemistriesinclude H₂SO₄:H₂O₂:H₂O:HF at 5:1:10:1 ratio, e.g., 98 vol % sulfuricacid mixed with 30 vol % hydrogen peroxide, water and 2.5 vol % HF at5:1:10:1 ratio. The chemistries include NH₄OH:H₂O₂:H₂O at 1:1:5 ratio,e.g., 38 vol % ammonium hydroxide mixed with 30 vol % hydrogen peroxideand water at 1:1:5 ratio. The chemistries also include NH₄OH:H₂O₂:H₂O at1:1:10, 1:1:20 ratios. The chemistries include NH₄OH:H₂O₂:H₂O:HF at1:1:10:1 ratio, e.g., 38 vol % ammonium hydroxide mixed with 30 vol %hydrogen peroxide, water and 2.5 vol % HF at 1:1:10:1 ratio.

The etch conditions include an etch time of 30 and 60 seconds, followedby a deionized water rinse for 120 seconds at room temperature. Thetemperature of the etch process is at 40 C.

The SPM combinations showed complete removal of 15 nm Cu but minimum Taand TaN etching. Zero etching of Ta and less than 0.2 nm etching of TaNare observed. The addition of HF in SPM formulations led to high Ta andTaN etching, e.g., greater than 2.8 nm for Ta at 60 s and 10 nm for TaNat either 30 or 60 sec.

The APM combinations at 1:1:5 ratio showed high Cu etching, e.g., >10 nmfor 30 s. The addition of HF in APM did not improve Ta and TaN etchrates.

FIG. 5B shows further evaluation of HF:H₂SO₄:H₂O and HF:HCl:H₂O mixturesfor different concentrations to optimize the mixture dilution. Threedifferent concentrations of 1:1:0, 1:1:2, and 1:1:4 are evaluated fortwo different etch times of 30 and 60 sec. A first HF:H₂SO₄:H₂O mixture,labeled H2SO4-1, has concentration of 1:1:0, e.g., a volume of 2.5 vol %hydrofluoric acid mixed with an equal volume of 98 vol % sulfuric acid.A second HF:H₂SO₄:H₂O mixture, labeled H2SO4-2, has concentration of1:1:2, e.g., a volume of 2.5 vol % hydrofluoric acid mixed with an equalvolume of 98 vol % sulfuric acid and two volumes of water. An absoluteconcentration of the second mixture can be calculated, resulted in aconcentration of HF to be 2.5/400=0.625 vol %, and a concentration ofH₂SO₄ to be 98/400=24.5 vol %.

A third HF:H₂SO₄:H₂O mixture, labeled H2SO4-4, has concentration of1:1:4, e.g., a volume of 2.5 vol % hydrofluoric acid mixed with an equalvolume of 98 vol % sulfuric acid and four volumes of water. An absoluteconcentration of the second mixture can be calculated, resulted in aconcentration of HF to be 2.5/600=0.42 vol %, and a concentration ofH₂SO₄ to be 98/400=16.3 vol %.

A first HF:HCl:H₂O mixture, labeled HCl-1, has concentration of 1:1:0,e.g., a volume of 2.5 vol % hydrofluoric acid mixed with an equal volumeof 38 vol % hydrochloric acid. A second HF:HCl:H₂O mixture, labeledHCl-2, has concentration of 1:1:2, e.g., a volume of 2.5 vol %hydrofluoric acid mixed with an equal volume of 36 vol % hydrochloricacid and two volumes of water. An absolute concentration of the secondmixture can be calculated, resulted in a concentration of HF to be2.5/400=0.625 vol %, and a concentration of HCl to be 36/400=9 vol %.

A third HF:HCl:H₂O mixture, labeled HCl-4, has concentration of 1:1:4,e.g., a volume of 2.5 vol % hydrofluoric acid mixed with an equal volumeof 36 vol % hydrochloric acid and four volumes of water. An absoluteconcentration of the second mixture can be calculated, resulted in aconcentration of HF to be 2.5/600=0.42 vol %, and a concentration of HClto be 36/600=6 vol %.

The etch conditions include an etch time of 30 and 60 seconds, followedby a deionized water rinse for 120 seconds at room temperature. Thetemperature of the etch process is at 40 C.

High Ta etch rate can be observed for high concentrations ofHF:H₂SO₄:H₂O and HF:HCl:H₂O mixture, as indicated in H2SO4-1 and HCl-1.Lower concentrations can provide the desirable etch rates and etchselectivity, e.g., about 1:1:1 for Cu/Ta/TaN. Further, longer etch timescan result in higher Ta etch rate, so for high concentrations, shorteretch times can be used. For example, at 1:1:2 mixture of HF:H₂SO₄:H₂O,e.g., H2SO4-2, a 30 second etch time can provide a selectivity of 1:1:1of Cu/Ta/TaN, with about 3-5 nm thickness etch. A same concentration for60 second etch time can significantly increase the Ta etch, e.g., about15 nm Ta thickness etch. Thus for HF:H₂SO₄:H₂O, a mixture ratio of 1:1:2can be used for 30 second etch, and a mixture ratio of 1:1:4 can be usedfor 60 second etch.

Similar results can be observed for HF:HCl:H₂O mixture, but with a lowerTa etch rate. Thus for HF:HCl:H₂O, a mixture ratio of 1:1:2 can be usedfor 60 second etch to achieve an etch selectivity of 1.2:1:1 ofCu/Ta/TaN.

In some embodiments, wet etch methods and solutions for selectiveetching copper with respect to the liner material are provided. The wetetch solutions can include a mixture of HF and H₂SO₄, or a mixture of HFand HCl.

In some embodiments, the concentration of HF in the HF/H₂SO₄ mixture canbe between 0.4 and 0.9 vol %, such as between 0.55 and 0.7 vol %, or canbe between 0.5 and 0.8 vol %, such as between 0.6 and 0.65 vol %. Theconcentration of H₂SO₄ in the HF/H₂SO₄ mixture can be between 20 and 30vol %, such as between 20 and 26 vol %, or can be between 21 and 28 vol%, such as between 22 and 27 vol %. For example, using HF having 2.5 vol% concentration, and H₂SO₄ having 96-98 vol % concentration, a HF/H₂SO₄mixture can include a mixture ratio of 1:1:2 for HF:H₂SO₄:H₂O.

In some embodiments, the concentration of HF in the HF/H₂SO₄ mixture canbe between 0.1 and 0.7 vol %, or can be between 0.3 and 0.5 vol %, suchas between 0.35 and 0.45 vol %. The concentration of H₂SO₄ in theHF/H₂SO₄ mixture can be between 5 and 25 vol %, such as between 12 and20 vol %, or can be between 14 and 18 vol %, such as between 14.5 and17.5 vol %. For example, using HF having 2.5 vol % concentration, andH₂SO₄ having 96-98 vol % concentration, a HF/H₂SO₄ mixture can include amixture ratio of 1:1:4 for HF:H₂SO₄:H₂O.

In some embodiments, the wet etch processes can include a process timebetween 30 and 60 seconds. The process temperature can be between 25 and40 C. In some embodiments, a water rinse can be performed, for example,using deionized water at a temperature between 15 and 35 C, such as roomtemperature, and for a time between 60 and 120 seconds. The rinsingprocess can remove the etch solution to prevent further etching.

In some embodiments, higher or lower concentrations of HF:H₂SO₄:H₂O,e.g., with less water content than 1:1:2 or with high water content than1:1:4 can be used, with appropriate etch times. For example, for highconcentrations, e.g., less water content than a 1:1:2, an etch time ofless than 30 seconds can be used. For low concentrations, e.g., highwater content than 1:1:4, an etch time of more than 60 seconds can beused.

In some embodiments, the concentration of HF in the HF/HCl mixture canbe between 0.4 and 0.9 vol %, such as between 0.55 and 0.7 vol %, or canbe between 0.5 and 0.8 vol %, such as between 0.6 and 0.65 vol %. Theconcentration of HCl in the HF/HCl mixture can be between 5 and 12 vol%, such as between 6 and 11 vol %, or can be between 7 and 10 vol %,such as between 7 and 9 vol %. For example, using HF having 2.5 vol %concentration, and HCl having 36 vol % concentration, a HF/HCl mixturecan include a mixture ratio of 1:1:2 for HF:HCl:H₂O.

Alternatively, the concentration of HF in the HF/HCl mixture can bebetween 0.1 and 0.7 vol %, or can be between 0.3 and 0.5 vol %, such asbetween 0.35 and 0.45 vol %. The concentration of HCl in the HF/HClmixture can be between 1 and 10 vol %, such as between 2 and 9 vol %, orcan be between 3 and 8 vol %, such as between 4 and 7 vol %. Forexample, using HF having 2.5 vol % concentration, and HCl having 36 vol% concentration, a HF/HCl mixture can include a mixture ratio of 1:1:4for HF:HCl:H₂O.

In some embodiments, the wet etch processes can include a process timebetween 30 and 60 seconds. The process temperature can be between 25 and40 C. In some embodiments, a water rinse can be performed, for example,using deionized water at a temperature between 15 and 35 C, such as roomtemperature, and for a time between 60 and 120 seconds. The rinsingprocess can remove the etch solution to prevent further etching.

In some embodiments, higher or lower concentrations of HF:HCl:H₂O, e.g.,with less water content than 1:1:2 or with high water content than 1:1:4can be used, with appropriate etch times. For example, for highconcentrations, e.g., less water content than a 1:1:2, an etch time ofless than 30 seconds can be used. For low concentrations, e.g., highwater content than 1:1:4, an etch time of more than 60 seconds can beused.

In some embodiments, different hardmask materials are evaluated toreduce the etching of the dielectric layer. SiC-based materials, such asSiC and SiCN, together with SiN are tested for selectivity with respectto copper, Ta, and TaN etching.

FIG. 6 illustrates thickness losses of different hardmask materialsaccording to some embodiments. Different chemical compositions, e.g.,HF:H₂SO₄:H₂O and HF:HCl:H₂O, different concentrations, e.g., 1:1:2 and1:1:4, and different etch times, e.g., 30, 60 and 120 seconds, are usedon different hardmask materials, e.g., SiCN, SiC, and SiN.

The thickness loss of SiN can be high, at 40-50 nm for any etch time. Itseems that all SiN can be etched, regardless of the etch compositions,etch concentrations, or etch times. As a comparison, the thickness lossof copper, Ta, and TaN is about 2 nm for a copper/liner recessstructure. Thus SiN might not be suitable as a hardmask material forprotecting the underlayer dielectrics.

The thickness loss of SiCN is much lower, at about 0.4-1 nm, dependingon etch compositions, etch concentrations, and etch times. For example,higher etch times and higher etch concentrations can result in higherSiCN thickness loss. Further, HF:H₂SO₄:H₂O can provide a higher SiCNetch rate than HF:HCl:H₂O. Compared with the recess structure of 2 nmthickness loss for copper, the thickness loss of SiCN might beborderline acceptable.

The thickness loss of SiC is even lower, at about 0.05-0.08 nm, whichcan be regarded as within the accuracy of the thickness measurement.Thus for the tested chemical compositions, concentrations and etchtimes, SiC can be considered as not affected, e.g., not etched.

Thus a SiC hardmask can provide a better selectivity for a recessstructure. The SiC integration scheme can exhibit a recess of Cu/Ta/TaNat 1:1:1 or 2:1:1 selectivity using a mixture of acid fluoride such asHF:H₂SO₄:H₂O at 1:1:2 or 1:1:4 concentrations or HF:HCl:H₂O at 1:1:2 or1:1:4 concentrations at 30-60 sec at 25-40 C. For example, an exposureto this process condition can remove about 2-3 nm of Cu, 1.5-2 nm of Ta,and 1.5-2.5 nm of TaN, with the etch rate of a SiC hardmask less than0.1 nm/min to successfully protect the underlying dielectric layer.

In some embodiments, these chemistry mixtures can allow a greatercontrol of the etching process. For example, a tunable etch rate can beachieved based on the relative concentrations of the fluoride, acid andwater, as well as the process times and temperatures. Further, this wetmixture can etch Cu, Ta, and TaN in a single step. In addition, theprocess time can be short, e.g., less than 1 minute, thus can reducemanufacturing cost. Also, the wet etching process can be uniform acrossthe three metals surface, as measured by an atomic force microscope(AFM) roughness measurement.

For example, after an HF:H₂SO₄:H₂O etch at 60 s, 40 C, the roughness ofTa increases from 0.2 nm to 1 nm or from 0.4 nm to 1.7 nm, and theroughness of TaN increases from 0.2 nm to 0.5 nm. After an HF:HCl:H₂Oetch at 60 s, 40 C, the roughness of Ta increases from 0.2 nm to 0.8 nmor from 0.4 nm to 1.5 nm, and the roughness of TaN increases from 0.2 nmto 0.4 nm. The increase in roughness after the clean process can be lessthan 1 nm.

FIGS. 7A-7B illustrate flow charts for forming a recess structure ofcopper, Ta, and TaN according to some embodiments. A semiconductorstructure can be recessed with an etch solution of HF:H₂SO₄:H₂O orHF:HCl:H₂O.

In FIG. 7A, operation 700 provides a substrate, wherein the substratecomprises a dielectric layer, wherein the dielectric layer has aplurality of embedded interconnect trenches, wherein the plurality ofinterconnect trenches comprise a liner film covering a copper film,wherein the liner film comprises at least one of Ta and TaN. In someembodiments, the plurality of embedded interconnect trenches is formedby a chemical mechanical polishing process. A SiC hardmask can be formedon the dielectric layer. The thickness of the SiC layer can be between10 nm and 100 nm.

Operation 710 applies an etch solution to the substrate, wherein theetch solution comprises HF, H₂SO₄, and H₂O, wherein the concentration ofHF is between 0.5 and 0.8 vol %, wherein the concentration of H₂SO₄ isbetween 21 and 28 vol %. Other concentrations can be used, such as theconcentration of HF in the HF/H₂SO₄ mixture can be between 0.4 and 0.9vol %, such as between 0.55 and 0.7 vol %. The concentration of H₂SO₄ inthe HF/H₂SO₄ mixture can be between 20 and 30 vol %, such as between 20and 26 vol %.

In FIG. 7B, operation 750 provides a substrate, wherein the substratecomprises a dielectric layer, wherein the dielectric layer has aplurality of embedded interconnect trenches, wherein the plurality ofinterconnect trenches comprise a liner film covering a copper film,wherein the liner film comprises at least one of Ta and TaN. In someembodiments, the plurality of embedded interconnect trenches is formedby a chemical mechanical polishing process. A SiC hardmask can be formedon the dielectric layer. The thickness of the SiC layer can be between10 nm and 100 nm.

Operation 760 applies an etch solution to the substrate, wherein theetch solution comprises HF, HCl, and H₂O, wherein the concentration ofHF is between 0.5 and 0.8 vol %, wherein the concentration of HCl isbetween 6 and 11 vol %. Other concentrations can be used, such as theconcentration of HF in the HF/HCl mixture can be between 0.4 and 0.9 vol%, such as between 0.55 and 0.7 vol %. The concentration of HCl in theHF/HCl mixture can be between 5 and 12 vol %, such as between 6 and 11vol %.

In some embodiments, the wet etch processes can include a process timebetween 30 and 60 seconds. The process temperature can be between 25 and40 C. In some embodiments, a water rinse can be performed, for example,using deionized water at a temperature between 15 and 35 C, such as roomtemperature, and for a time between 60 and 120 seconds. The rinsingprocess can remove the etch solution to prevent further etching.

In some embodiments, the etch solution can selectively etch the copperfilm with respect to the liner film, wherein the copper film is etchedbetween 2 and 3 nm, wherein the liner film is etched between 1.5 and 2nm.

FIGS. 8A-8B illustrate other flow charts for forming a recess structureof copper, Ta, and TaN according to some embodiments. A semiconductorstructure can be recessed with an etch solution of HF:H₂SO₄:H₂O orHF:HCl:H₂O.

In FIG. 8A, operation 800 provides a substrate, wherein the substratecomprises a dielectric layer, wherein the dielectric layer has aplurality of embedded interconnect trenches, wherein the plurality ofinterconnect trenches comprise a liner film covering a copper film,wherein the liner film comprises at least one of Ta and TaN. In someembodiments, the plurality of embedded interconnect trenches is formedby a chemical mechanical polishing process. A SiC hardmask can be formedon the dielectric layer. The thickness of the SiC layer can be between10 nm and 100 nm.

Operation 810 applies an etch solution to the substrate, wherein theetch solution comprises HF, H₂SO₄, and H₂O, wherein the concentration ofHF is between 0.3 and 0.5 vol %, wherein the concentration of H₂SO₄ isbetween 14 and 18 vol %. Other concentrations can be used, such as theconcentration of HF in the HF/H₂SO₄ mixture can be between 0.1 and 0.7vol %. The concentration of H₂SO₄ in the HF/H₂SO₄ mixture can be between5 and 25 vol %, such as between 12 and 20 vol %.

In FIG. 8B, operation 850 provides a substrate, wherein the substratecomprises a dielectric layer, wherein the dielectric layer has aplurality of embedded interconnect trenches, wherein the plurality ofinterconnect trenches comprise a liner film covering a copper film,wherein the liner film comprises at least one of Ta and TaN. In someembodiments, the plurality of embedded interconnect trenches is formedby a chemical mechanical polishing process. A SiC hardmask can be formedon the dielectric layer. The thickness of the SiC layer can be between10 nm and 100 nm.

Operation 860 applies an etch solution to the substrate, wherein theetch solution comprises HF, HCl, and H₂O, wherein the concentration ofHF is between 0.3 and 0.5 vol %, wherein the concentration of HCl isbetween 3 and 8 vol %. Other concentrations can be used, such as theconcentration of HF in the HF/HCl mixture can be between 0.1 and 0.7 vol%. The concentration of HCl in the HF/HCl mixture can be between 1 and10 vol %, such as between 2 and 9 vol %.

In some embodiments, the wet etch processes can include a process timebetween 30 and 60 seconds. The process temperature can be between 25 and40 C. In some embodiments, a water rinse can be performed, for example,using deionized water at a temperature between 15 and 35 C, such as roomtemperature, and for a time between 60 and 120 seconds. The rinsingprocess can remove the etch solution to prevent further etching.

In some embodiments, the etch solution can selectively etch the copperfilm with respect to the liner film, wherein the copper film is etchedbetween 2 and 3 nm, wherein the liner film is etched between 1.5 and 2nm.

Although the foregoing examples have been described in some detail forpurposes of clarity of understanding, the invention is not limited tothe details provided. There are many alternative ways of implementingthe invention. The disclosed examples are illustrative and notrestrictive.

What is claimed is:
 1. A method comprising providing a substrate;forming a dielectric layer above the substrate; forming a plurality oftrenches in the dielectric layer; forming a liner layer above thedielectric layer in the trenches, wherein the liner layer comprises atleast one of Ta or TaN; forming a copper layer above the liner layer,wherein the copper layer fills in the trenches; planarizing the linerlayer and the copper layer so that a portion of the liner layer andcopper layers are removed to expose the dielectric layer; and applyingan etch solution to the substrate, wherein the etch solution comprisesHF, HCl, and H₂O, wherein a concentration of HF is between 0.5 and 0.8vol %, and wherein a concentration of HCl is between 7 and 10 vol %. 2.A method as in claim 1 wherein the etch solution selectively etches thecopper film with respect to the liner film, wherein the copper film isetched between 2 and 3 nm, wherein the liner film is etched between 1.5and 2 nm.
 3. A method as in claim 1 wherein the etch solution comprisesHF:HCl:H₂O at 1:1:2 volume ratio using 2.5 vol % HF and 30-36 vol % HCl.4. A method as in claim 1 wherein the etch solution is applied for atime between 30 and 60 seconds.
 5. A method as in claim 1 wherein theetch solution is at a temperature between 25 and 40 C.
 6. A method as inclaim 1 further comprising rinsing the substrate in water.
 7. A methodas in claim 1 wherein rinsing the substrate in water is at a temperaturebetween 15 and 35 C for a time between 60 and 120 seconds.
 8. A methodas in claim 1 wherein the planarizing process is performed by a chemicalmechanical polishing process.
 9. A method as in claim 1 furthercomprising forming a SiC layer on the dielectric layer.
 10. A method asin claim 9 wherein a thickness of the SiC layer is between 10 nm and 100nm.
 11. A method comprising providing a substrate; forming a dielectriclayer above the substrate; forming a plurality of trenches in thedielectric layer; forming a liner layer above the dielectric layer inthe trenches, wherein the liner layer comprises at least one of Ta orTaN; forming a copper layer above the liner layer, wherein the copperlayer fills in the trenches; planarizing the liner layer and the copperlayer so that a portion of the liner layer and copper layers are removedto expose the dielectric layer; and applying an etch solution to thesubstrate, wherein the etch solution comprises HF, HCl, and H₂O, whereina concentration of HF is between 0.3 and 0.5 vol %, wherein aconcentration of HCl is between 4 and 7 vol %.
 12. A method as in claim11 wherein the etch solution comprises HF:HCl:H₂O at 1:1:4 volume ratiousing 2.5 vol % HF and 30-36 vol % HCl.
 13. A method as in claim 11wherein the etch solution is applied for a time between 30 and 60seconds, wherein the etch solution is at a temperature between 25 and 40C.
 14. A method as in claim 11 further comprising rinsing the substratein water for a time between 60 and 120 seconds, wherein the water is ata temperature between 15 and 35 C.
 15. A method as in claim 11 furthercomprising forming a SiC layer on the dielectric layer.
 16. A devicecomprising a substrate; a dielectric layer formed above the substrate; aSiC layer formed above the dielectric layer; a plurality of interconnecttrenches embedded through the SiC layer and within the dielectric layer;wherein the plurality of interconnect trenches comprise a liner layerand a copper layer, wherein the liner layer is formed above thedielectric layer in the trenches, wherein the copper layer is formedabove the liner layer and filled in the trenches, wherein the linerlayer comprises at least one of Ta or TaN, wherein the copper layer isrecessed with respect to the SiC layer by an amount between 2 and 3 nm,and wherein the liner layer is recessed with respect to the SiC layer byan amount between 1.5 and 2 nm, wherein the recess of the copper andliner layers is performed by a etch solution, wherein the etch solutioncomprises HF, HCl, and H₂O.
 17. A device as in claim 16 wherein aconcentration of HF is between 0.5 and 0.8 vol %, wherein aconcentration of HCl is between 6 and 9 vol %.
 18. A device as in claim16 wherein the etch solution comprises HF:HCl:H₂O at 1:1:2 volume ratiousing 2.5 vol % HF and 30-36 vol % HCl.
 19. A device as in claim 16wherein a concentration of HF is between 0.3 and 0.5 vol %, wherein aconcentration of HCl is between 4 and 7 vol %.
 20. A device as in claim16 wherein the etch solution comprises HF:HCl:H₂O at 1:1:4 volume ratiousing 2.5 vol % HF and 30-36 vol % HCl.